MR18R326GAG0 Datasheet, PDF, Circuit Diagram, Application Notes

MR18R326GAG0 Application,Package,Pin

Application : (32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V

Manufacturer : Samsung semiconductor

Package :

Pin :

Datasheet PDF

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Application : (32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V

Manufacturer : Samsung semiconductor

Package :

Pin :

Datasheet PDF

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Application : (32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V

Manufacturer : Samsung semiconductor

Package :

Pin :

Datasheet PDF

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Application : (32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V

Manufacturer : SAMSUNG[Samsung semiconductor]

Package :

Pin :

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